3M Double Coated Polyester Tape 442KW, 48 in x 36 yds, with No Liner

Key points

• Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing
• Rubber based adhesive provides fast, reliable bonding strength and removes cleanly
• Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens
• Also applicable for polishing pad attachment to platens in HDD and glass manufacturing
• Polyester carrier film helps improve handling for uniform application
• Release liner adds dimensional stability for fast and efficient conversion