About this item
3M Hot Melt Adhesive 3731, Tan, Chips, 22 lb
- 7100031985
- 3M
- Flexible Adhesives
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Datasheet
Key points
- Solvent-free, 100% solids adhesive
- Bonds well to polyolefin based plastics
- High-temperature resistance to 265ºF/129ºC
- Fast-setting for quick, effective results
- Provides good peel strength, creating tough and resilient bonds
Description
3M™ Hot Melt Adhesive 3731 is a 100% solids, high heat resistant thermoplastic adhesive that liquefies to bonds to a variety of substrates, including polyethylene, polypropylene and other plastics.Bonds Well to Polyolefin Based Plastics
Engineered to deliver excellent results, 3M™ Hot Melt Adhesive 3731 provides high heat resistance up to 265ºF/129ºC without lifting or deformation. This hot melt adhesive bonds well to a variety of substrates and is an ideal adhesive for bonding polyolefin based plastics, including polyethylene and polypropylene. In addition, 3M™ Hot Melt Adhesive 3731 is fast setting, with an open bead time of 30 seconds, for applications requiring quick bond times. Designed to provide good peel strength, 3M™ Hot Melt Adhesive 3731 creates a resilient bond that is long-lasting, offering confidence and peace of mind for a wide range of applications. For use with the 3M™ Hot Melt Applicator EC or 3M™ Hot Melt Applicator TC.
Recommended Applications
- Ideal for bonding polyolefin based plastics
- For applications requiring quick bond times
Understanding Hot Melt Adhesives
Applied with 3M Adhesive Applicators, hot melt adhesives extrude as liquefied thermoplastic to fill gaps and wet entire bonding surfaces before setting. As a result, they often exceed 100 psi shear strength for quick, convenient strength. Hot melt adhesives are used for bonding a wide variety of materials ranging from wood to corrugated cardboard, heat-sensitive foam, plastics and metals. Unlike mechanical fasteners or sealing tapes, hot melt adhesives are virtually invisible between mating surfaces. These 100% solids thermoplastic resins are available in a variety of strengths, temperatures and pen time/bonding ranges to meet your specific application demands.